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Force sensors for microelectronic packaging applications / J. Sch wizer, M. Mayer, O. Brand.

By: Contributor(s): Material type: TextTextSeries: Microtechnology and MEMSPublication details: Berlin ; New York : Springer, 2004.Description: viii, 178 p. : ill. ; 24 cmISBN:
  • 3540221875 (hbk.)
Subject(s): DDC classification:
  • 621.381/046 22
Online resources:
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Includes bibliographical references (p. [165]-174) and index.

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