Force sensors for microelectronic packaging applications /
Schwizer, Jurg.
Force sensors for microelectronic packaging applications / J. Sch wizer, M. Mayer, O. Brand. - Berlin ; New York : Springer, 2004. - viii, 178 p. : ill. ; 24 cm - Microtechnology and MEMS .
Includes bibliographical references (p. [165]-174) and index.
3540221875 (hbk.)
2004-110615
971632855 GyFmDB
Microelectronic packaging.
Wire bonding (Electronic packaging)
621.381/046
Force sensors for microelectronic packaging applications / J. Sch wizer, M. Mayer, O. Brand. - Berlin ; New York : Springer, 2004. - viii, 178 p. : ill. ; 24 cm - Microtechnology and MEMS .
Includes bibliographical references (p. [165]-174) and index.
3540221875 (hbk.)
2004-110615
971632855 GyFmDB
Microelectronic packaging.
Wire bonding (Electronic packaging)
621.381/046