| 000 | 01280cam a22003497a 4500 | ||
|---|---|---|---|
| 001 | vtls000328746 | ||
| 003 | UG-KaMUL | ||
| 005 | 20250613004003.0 | ||
| 010 | _a2004-110615 | ||
| 016 |
_a971632855 _2 GyFmDB |
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| 020 | _a3540221875 (hbk.) | ||
| 035 | _a13660907 | ||
| 039 |
_y 201509031926 _z930 |
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| 040 |
_aUKM _c UKM _d OHX _d PU _d DLC _d UG-KaMUL |
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| 082 |
_a621.381/046 _2 22 |
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| 092 | _a621.381046 SCHW | ||
| 100 | _aSchwizer, Jurg. | ||
| 245 |
_a Force sensors for microelectronic packaging applications / _cJ. Sch wizer, M. Mayer, O. Brand. |
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| 260 |
_aBerlin ; _a New York : _bSpringer, _c 2004. |
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| 300 |
_aviii, 178 p. : _bill. ; _c 24 cm |
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| 440 | _aMicrotechnology and MEMS | ||
| 504 | _aIncludes bibliographical references (p. [165]-174) and index. | ||
| 650 | _aMicroelectronic packaging. | ||
| 650 | _aWire bonding (Electronic packaging) | ||
| 700 |
_aMayer, M. _q (Michael Andreas), _d 1971- |
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| 700 |
_aBrand, Oliver, _d 1964- |
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| 856 |
_3 Table of contents _u http://www.loc.gov/catdir/toc/fy054/2004110615. html |
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| 856 |
_3 Publisher description _u http://www.loc.gov/catdir/enhancements/fy08 18/2004110615-d.html |
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| 942 |
_2ddc _cBK |
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| 999 |
_c558275 _d558275 |
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