Schwizer, Jurg. <br/><br/>
Force sensors for microelectronic packaging applications / 
J. Sch wizer, M. Mayer, O. Brand. 
 - Berlin ;   New York :  Springer,  2004. 
 - viii, 178 p. :  ill. ;  24 cm 
 - Microtechnology and MEMS .
<br/><br/>Includes bibliographical references (p. [165]-174) and index. 
<br/><br/><label>ISBN: </label>3540221875 (hbk.) 
<br/><br/><label>LCCN: </label>2004-110615 
<br/><br/><label>Nat. Bib. Agency Control No.: </label>971632855  GyFmDB 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging.<br/>Wire bonding (Electronic packaging)
<br/><br/><label>Dewey Class. No.: </label>621.381/046